High-Performance Electronic Encapsulation Adhesives: Modification Technologies and Application Breakthroughs of Epoxy Resins

Electronic Encapsulation Adhesives

Electronic encapsulation adhesives are a type of electronic glue or bonding agent used for sealing, potting, or encapsulating electronic components.

Once encapsulated, these adhesives provide multiple protective functions, such as waterproofing, moisture resistance, vibration resistance, dustproofing, corrosion protection, heat dissipation, and confidentiality.

Therefore, electronic encapsulation adhesives must possess characteristics such as high and low temperature resistance, high dielectric strength, excellent insulation, and environmental safety.

Why Choose Epoxy Resin?

With the continuous development of large-scale integrated circuits and the miniaturization of electronic components, the issue of heat dissipation has become a key factor affecting the service life of these components.

This creates an urgent need for high thermal conductivity adhesives with superior heat dissipation properties as encapsulation materials.

Epoxy resin exhibits excellent thermal resistance, electrical insulation, adhesion, dielectric properties, mechanical strength, low shrinkage, and chemical resistance.

When mixed with curing agents, it also provides good processability and operability.

As a result, epoxy resin has been widely adopted in the encapsulation of semiconductor devices, especially in overseas markets.

Development of Epoxy Resins

With growing environmental awareness and the increasing performance requirements for electronic encapsulation materials in the integrated circuit industry, higher standards have been set for epoxy resins.

For IC encapsulation, epoxy resins must not only achieve high purity but also exhibit low stress, high thermal shock resistance, and low water absorption—issues that urgently need to be addressed.

To overcome challenges such as high-temperature resistance and low water absorption, research efforts at home and abroad have focused on molecular structure design, mainly involving blending modification and the synthesis of new epoxy resins.

On one hand, biphenyl, naphthalene, sulfone, and fluorine groups have been introduced into the epoxy backbone to enhance the moisture and heat resistance of the cured materials.

On the other hand, several representative curing agents have been studied to investigate the curing kinetics, glass transition temperature, thermal decomposition temperature, and water absorption properties of cured systems, with the goal of developing high-performance epoxy resins for advanced electronic encapsulation materials.