Blog - Jiangsu Tetra New Material Technology Co., Ltd.

01

2025.11

Under the Dual-Carbon and Intelligent Manufacturing Wave: How UV Curing Technology Is Reshaping the New Paradigm of Industrial Coatings

In today’s era of deep integration between the “dual-carbon” goals (carbon peaking and carbon neutrality) and intelligent manufacturing, the green transformation of industry has evolved from a conc...

13

2025.10

3D Printing Technology Is Reshaping Our Lives

3D printing technology is profoundly transforming the way we live — from customized toys and medical implants to architectural innovations.The integration of AI is accelerating its evolution, while t...

06

2025.10

High-Performance Electronic Encapsulation Adhesives: Modification Technologies and Application Breakthroughs of Epoxy Resins

Electronic Encapsulation AdhesivesElectronic encapsulation adhesives are a type of electronic glue or bonding agent used for sealing, potting, or encapsulating electronic components.Once encapsulated,...

30

2025.09

Market Size and Development Trends of Advanced Semiconductor Packaging and Testing

Definition of Advanced PackagingAdvanced packaging refers to a packaging solution that achieves process complexity through innovative structural design, interconnection technology, materials, and equi...

11

2025.09

An Overview of the Basic Knowledge of Epoxy Resins and Epoxy Adhesives

(I) Concept of Epoxy ResinEpoxy resin refers to a class of high-molecular compounds containing two or more epoxy groups in their molecular chains. It is a thermosetting resin, with bisphenol A-type ep...

04

2025.09

UV Adhesive: Innovations and Application Prospects of Light-Curing Technology

In today’s rapidly evolving manufacturing industry, efficient and environmentally friendly bonding technologies have become one of the key drivers of industrial development. UV adhesive (ultraviolet ...

02

2025.09

Selection of Epoxy Resins for Electronic Packaging

Which epoxy resin is effective for electronic packaging? In the field of electronic packaging, epoxy resins are widely used as packaging materials due to their excellent insulation, adhesion, chemic...

31

2025.08

How to Choose the Right Resin to Improve Ink Adhesion

Selecting the appropriate resin to enhance ink adhesion requires a comprehensive consideration of factors such as substrate characteristics, ink drying methods, and application scenario requirements. ...

29

2025.08

Core Applications and Development Trends of Epoxy Resins in PCB Substrates

Epoxy resins play a critical role in the manufacturing of printed circuit boards (PCB), serving as one of the core materials for PCB substrates due to their excellent insulation properties, mechanical...

27

2025.08

Classification and Selection Methods of Electronic Adhesives

Electronic adhesives for microelectronic packaging can be divided into two main categories based on packaging types: semiconductor IC packaging adhesives and PCB board-level assembly adhesives. Semico...

25

2025.08

Analysis of Epoxy Resin Applications: Material Selection from Sealants to Electronic Encapsulation

In the field of materials science, epoxy resin plays a vital role in multiple industries due to its excellent properties. From everyday sealants to high-end electronic encapsulation, epoxy resin has b...

19

2025.07

Composite Epoxy Materials: Powering the Future of Aerospace Innovation

Aerospace engineers face an extraordinary challenge: building structures that must withstand extreme conditions while remaining exceptionally lightweight. This is where composite epoxy materials emerg...