Blog - Jiangsu Tetra New Material Technology Co., Ltd.

19

2025.11

Application of Solid Epoxy Resins in 3D Printing and Research on Enhancing Isotropy

Solid epoxy resins are widely used in 3D printing for the production of various functional components. According to an article by science writer Reginald Davey—summarized by Nanjixiong—this paper fo...

16

2025.11

Application of Epoxy Resins in the Main Insulation of High-Voltage Motors

High-voltage motors can be categorized into generators and motors. Historically, as power generation capacity increased, generator sizes continuously expanded, placing higher technological demands on ...

13

2025.11

A Comprehensive Overview of High-Performance Epoxy Resins for Electronic Packaging

Electronic encapsulants are adhesives used to seal, pot, or encapsulate electronic components. After encapsulation, they provide protection against water, moisture, shock, dust, corrosion, and also en...

01

2025.11

Under the Dual-Carbon and Intelligent Manufacturing Wave: How UV Curing Technology Is Reshaping the New Paradigm of Industrial Coatings

In today’s era of deep integration between the “dual-carbon” goals (carbon peaking and carbon neutrality) and intelligent manufacturing, the green transformation of industry has evolved from a conc...

13

2025.10

3D Printing Technology Is Reshaping Our Lives

3D printing technology is profoundly transforming the way we live — from customized toys and medical implants to architectural innovations.The integration of AI is accelerating its evolution, while t...

06

2025.10

High-Performance Electronic Encapsulation Adhesives: Modification Technologies and Application Breakthroughs of Epoxy Resins

Electronic Encapsulation AdhesivesElectronic encapsulation adhesives are a type of electronic glue or bonding agent used for sealing, potting, or encapsulating electronic components.Once encapsulated,...

30

2025.09

Market Size and Development Trends of Advanced Semiconductor Packaging and Testing

Definition of Advanced PackagingAdvanced packaging refers to a packaging solution that achieves process complexity through innovative structural design, interconnection technology, materials, and equi...

11

2025.09

An Overview of the Basic Knowledge of Epoxy Resins and Epoxy Adhesives

(I) Concept of Epoxy ResinEpoxy resin refers to a class of high-molecular compounds containing two or more epoxy groups in their molecular chains. It is a thermosetting resin, with bisphenol A-type ep...

04

2025.09

UV Adhesive: Innovations and Application Prospects of Light-Curing Technology

In today’s rapidly evolving manufacturing industry, efficient and environmentally friendly bonding technologies have become one of the key drivers of industrial development. UV adhesive (ultraviolet ...

02

2025.09

Selection of Epoxy Resins for Electronic Packaging

Which epoxy resin is effective for electronic packaging? In the field of electronic packaging, epoxy resins are widely used as packaging materials due to their excellent insulation, adhesion, chemic...

31

2025.08

How to Choose the Right Resin to Improve Ink Adhesion

Selecting the appropriate resin to enhance ink adhesion requires a comprehensive consideration of factors such as substrate characteristics, ink drying methods, and application scenario requirements. ...

29

2025.08

Core Applications and Development Trends of Epoxy Resins in PCB Substrates

Epoxy resins play a critical role in the manufacturing of printed circuit boards (PCB), serving as one of the core materials for PCB substrates due to their excellent insulation properties, mechanical...