Jiangsu Tetra New Material Technology Co., Ltd.
Jiangsu Tetra New Material Technology Co., Ltd.

Application Field of Cycloaliphatic Epoxy Resin

1. UV Curable Coating Ink

At present, domestic photocurable coating ink is mainly a free radical system. UV-curable ink coatings account for only 1-3% of global ink coatings. Free radical UV-curable ink coatings have not achieved the expected results in some applications, and there are still some bottlenecks to be broken through, and some defects to be improved, such as too large shrinkage, poor weather resistance, and high halogen content. The cation system can make up for these defects of the free radical system.

And cationic curing resin (transparent coating, printing ink, adhesive, stereolithography) is a photo-processing technology that makes liquid resin polymerize into the solid state at a high speed through ultraviolet irradiation with a certain wavelength. It saves energy, does not contain solvent, has a protective effect on the ecological environment, and will not discharge toxic gas and carbon dioxide into the atmosphere, so it is known as "green technology".

A certain proportion of cycloaliphatic epoxy resins need to be added to light-curing coatings and inks.

Fast cure speed, low shrinkage, no wrinkling on that surface, strong adhesion, and corrosion resistance, which not only retain the properties of the original epoxy resin but also greatly accelerates its curing speed, so that it can be cured within minutes or even seconds, thus greatly improving the labor productivity.

The cured paint film and ink obtained by photo-curing technology have the following advantages: energy saving, environmental protection, high quality, and high efficiency.

2. Insulating Materials

Electrical insulation materials include epoxy coating for electrical insulation, resin insulators, gas insulation combined electrical equipment, etc.

As the heart of the motor, the performance of the insulation system directly affects the reliability and service life of the motor. Thermal breakdown caused by dielectric loss is a common concern in motor insulation, especially in variable frequency motor insulation, the degree of insulation heating is much higher than that of power frequency motor. Therefore, higher requirements are put forward for insulating impregnating resin, which needs higher heat resistance and lower dielectric loss to ensure the safe operation of the motor insulation system.

TTA21 (3,4-epoxycyclohexylmethyl-3 4 epoxycyclohexane carboxylate) series products,  as raw materials of impregnating resin, have high-performance stability, excellent electrical properties, and low dielectric loss, and are suitable for the insulation treatment of coils and windings of high-power traction motors. VPI resin-related data

3. Composite Materials

Cycloaliphatic epoxy compounds have good heat resistance, mechanical properties, and weather resistance, especially low viscosity and long service life, and are especially suitable for wet lamination molding and winding molding to manufacture high-strength heat-resistant composite materials.

4. 3D Printing

Cycloaliphatic epoxy resin for 3d printing has the characteristics of low curing shrinkage, low VOC, low viscosity, almost colorless and transparent overall, good yellowing resistance, and weather resistance. With high accuracy, it is suitable for making precision molds and molds.

5. Adhesive

Epoxy adhesive is made of specialty epoxy resin. There are epoxy groups at the end of the resin macromolecule, hydroxyl groups and ether bonds between chains, and hydroxyl groups and ether bonds will continue to be produced during the curing process. The structure contains benzene rings and heterocycles, which determine the excellent performance of epoxy resin adhesive. Epoxy adhesive is a kind of adhesive with a long history and a wide range of applications. Because of its strength, diversity, and excellent adhesion to various surfaces, epoxy resin adhesive has been widely recognized by users. TTA's cycloaliphatic epoxy resin-related products can be used as the main resin in low-halogen or even halogen-free electronic packaging adhesives, and can effectively improve the heat resistance of the colloid.

6. Electronic Encapsulation

Encapsulation means that the liquid epoxy resin compound is poured into the device with electronic components and circuits by mechanical or manual means, and cured at room temperature or under heating conditions to become a thermogenic polymer insulation material with excellent performance. Its function is to strengthen the integrity of electronic devices and improve the resistance to external impact and vibration; Improving the insulation between internal components and circuits is beneficial to miniaturization and light weight of devices; Avoiding direct exposure of components and circuits, and improve the waterproof and moisture-proof performance of devices.

7. LED Packaging

In recent years, the LED industry has developed rapidly, and experts in the industry are generally optimistic about the market prospects. LED is a special semiconductor device. In use, the radiated light will be lost when it is emitted. By coating a transparent adhesive layer with a high refractive index on the surface of the chip, that is packaging adhesive. Because the packaging glue layer is between the chip and the air, it can effectively reduce the loss of light at the interface and improve the light output efficiency. In addition, the role of packaging glue also includes mechanical protection and stress release of the chip, and as a light guide structure, it is required to have high light transmittance and refractive index, good thermal stability, and strong adhesion.